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> Microjoin 4000 pulse hot bar soldering bonder system
Microjoin 4000 pulse hot bar soldering bonder system
Microjoin 4000 Pulse Heat Hot Bar Bonding Bonder System Used
Model/Part No:4000 Our Item ID: 2833
MicroJoin's Model 4000 is a computer-controlled bonding system for ACF, heat seal, and reflow solder applications that now includes Windows NT-based software for easy setup, simplified user operation, and extensive process control across a variety of hot bar applications. The system can drive up to four independent precision hot bar temperature controllers and can be configured with a variety of X-Y and/or rotary motion systems. It is ideal for low-to-medium volume soldering and conductive adhesive bonding, such as flex interconnects, LCD display modules, heat seal connections to PCB or glass, TAB to board, and ribbon cables. The Model 4000's software provides graphical display of command and measurement data and enables the user to optimize the time and temperature profile for any specific Joining application. The software also interfaces with spreadsheets and SPC packages for full analysis of process parameters, and has an option for integrating a local barcode reader to simplify capture of information on lots, pieces, serial numbers, and other tracking data.
Item Tested?: Not TestedPhysical Condition: Good; Working Condition: Not Tested, or Unable To Test140 | 32x 28x34 | 1
